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LTC3210-1
PIN FUNCTIONS
C1P, C2P, C1M, C2M (Pins 1, 16, 14, 13): Charge Pump
Flying Capacitor Pins. A 2.2μF X7R or X5R ceramic ca-
pacitor should be connected from C1P to C1M and C2P
to C2M.
CPO (Pin 2): Output of the Charge Pump Used to Power
All LEDs. This pin is enabled or disabled using the ENM
and ENC inputs. A 2.2μF X5R or X7R ceramic capacitor
should be connected to ground.
ENM, ENC (Pins 3, 10): Inputs. The ENM and ENC pins
are used to program the LED output currents. The ENC
pin is strobed up to 7 times to decrement the internal 3-bit
DAC’s from full-scale to 1 LSB. The ENM pin is strobed 63
times to decrement the 6-bit DAC from full-scale to 1 LSB.
The counters will stop at 1 LSB if the strobing continues.
The pin must be held high after the final desired positive
strobe edge and the data is transferred after a 150μs (typ)
delay. Holding the ENM or ENC pin low will clear the coun-
ter for the selected display and reset the LED current to
0. If both inputs are held low for longer than 150μs (typ)
the part will go into shutdown. The charge pump mode
is reset to 1x whenever ENC goes low or when the part
is shut down.
MLED1, MLED2, MLED3, MLED4 (Pins 4, 5, 6, 7):
Outputs. MLED1 to MLED4 are the MAIN current source
outputs. The LEDs are connected between CPO (anodes)
and MLED1-4 (cathodes). The current to each LED output
is set via the ENM input, and the programming resistor
connected between RM and GND. Each of the four LED
outputs can be disabled by connecting the output directly
to CPO. A 10μA current will flow through each directly
connected LED output.
RM, RC (Pins 8,9): LED Current Programming Resistor
Pins. The RM and RC pins will servo to 1.22V. Resistors
connected between each of these pins and GND are used
to set the high and low LED current levels. Connecting
a resistor 12k or less will cause the LTC3210-1 to enter
overcurrent shutdown.
CLED (Pin 11): Output. CLED is the CAM current source
output. The LED is connected between CPO (anode) and
CLED (cathode). The current to the LED output is set via
the ENC input, and the programming resistor connected
between RC and GND.
GND (Pin 12): Ground. This pin should be connected to
a low impedance ground plane.
V BAT (Pin 15): Supply voltage. This pin should be bypassed
with a 2.2μF, or greater low ESR ceramic capacitor.
Exposed Pad (Pin 17): This pad should be connected
directly to a low impedance ground plane for optimal
thermal and electrical performance.
32101fd
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